S- 7200 PCB X-ray Inspection Machine SMT PCB Electronics Production Detection Machinery

S-7000 SMT X Ray Inspection Component Detection Machine Electronics Production Inspection Equipment for PCBA

Introducing our another cutting-edge inspection system designed to detect welding defects in electronic components, providing unparalleled accuracy and reliability for quality assurance.

Experience state-of-the-art detection technology with our equipment designed for small and medium-sized products such as metal castings, welding parts, hardware products, plastic products, rubber products, and ceramic bodies. This advanced system offers precise, intelligent, and automated inspection capabilities.

Introducing our advanced on-line X-ray inspection machine, specifically designed for the automatic inspection of auto parts. This state-of-the-art system leverages image detection technology and X-ray perspective to convert visible light images, enabling high-definition imaging, automatic positioning, and precise image processing.

The MirXT-160 is a cutting-edge 3D X-ray inspection system tailored for advanced wafer technology, SMT, packaging inspection, semiconductor, and laboratory applications. It excels in detecting solder/tin voids and bonding wire issues commonly found in the SMT and semiconductor manufacturing processes within the electronics industry. The system effectively identifies packaging defects such as offsets, wire cross short circuits, flip-chip solder ball issues, wire breakage, and detachment.

Our advanced detection system is designed specifically to identify welding defects in electronic components, ensuring high-quality standards for various applications.

Experience the precision and reliability of our X-ray detection system, designed for use in semiconductor, SMT, DIP, and various electronic component inspections, including IC, BGA, CSP, and flip chips.

Our advanced X-ray detection system is engineered for semiconductor, SMT, DIP, and a variety of electronic components, including ICs, BGA, CSP, and flip chips, delivering unparalleled precision and efficiency.

Discover our high-performance inspection system, designed to meet universal inspection requirements with a strong penetrating ray source and HD FPD, ensuring comprehensive and accurate detection for various applications.

Our advanced inspection equipment is specifically designed for detecting BGA and chip components, nickel plate detection on metal plates, and FPC welding parts. It efficiently calculates bubble percentages, measures size and area, and analyzes internal defects such as low tin and virtual soldering in products.

Explore the cutting-edge semi-automatic online inspection technology for power battery electrode lugs with our state-of-the-art equipment. Designed to ensure precision and reliability, our battery inspection solutions detect the morphology of electrode lugs through advanced imaging techniques, providing unparalleled accuracy.